Extrusion Molding Process for Straight-through TWC Substrates


AddTime: 2026-08-21 Print Favorites Email: info@169chem.net
A brief introduction to the extrusion process for TWC straight-through substrates.

Extrusion Molding Process for Straight-through TWC Substrates

The TWC flow-through substrate is manufactured via an extrusion process, comprising four key stages: formulation, extrusion, drying, and sintering.

Raw Material Formulation

Cordierite serves as the primary material; the raw material ratio is as follows:

Component

Function

Proportion

Kaolin

Provides SiO₂ and Al₂O₃

40%-50%

Talc

Provides MgO

30%-40%

Alumina

Adjusts Al₂O₃ content

10%-20%

Binder

Improves plasticity

3%-8%

Pore-forming agent

Adjusts porosity

5%-10%

Mixing and Pugging

Powder + Water + Binder → Kneading (15–30 min) → Vacuum Pugging (-0.09 MPa, 2–4 passes) → Homogeneous, plastic clay body. Removing air bubbles during pugging is crucial for preventing extrusion defects.

Extrusion Molding

The clay body is extruded through a die to form a honeycomb green body with uniform channels:

Die: Core precision determines channel dimensions (tolerance ±0.05 mm)

Extrusion speed: 0.5–2 m/min

Channel specifications: 400–600 cpsi; wall thickness 2–4 mil (0.05–0.10 mm)

Shape: Primarily cylindrical; diameter 76–144 mm

Drying

Moisture content of green body: 15%–20% → Dried to 1%–2%

Method

Temperature

Time

Microwave drying

Microwave heating

5–20 minutes

Hot-air drying

80–120°C

4–12 hours

A combined microwave and hot-air process is commonly used in industry: rapid dehydration via microwave followed by gradual drying using hot air.

Sintering

The dried green body undergoes high-temperature sintering in a tunnel kiln:

Heating rate: Room temperature to 600°C (1–3°C/min, for binder burnout); 600–1200°C (3–5°C/min)

Maximum temperature: 1350–1420°C, with a holding time of 1–3 hours

Key specifications: Cordierite phase content ≥95%; coefficient of thermal expansion ≤1.5 × 10⁻⁶/°C

Post-processing

End-face grinding → High-pressure air purging → Inspection of cell density, wall thickness, compressive strength, and coefficient of thermal expansion

Summary

The extrusion process for TWC substrates can be summarized as follows: cordierite formulation → mixing and kneading → mold extrusion → microwave/hot-air drying → sintering at 1350–1420°C → post-processing. Mold precision determines channel dimensions, while sintering determines the cordierite phase content and the low coefficient of thermal expansion. This is a mature process suitable for continuous production and serves as the mainstream manufacturing route for TWC substrates.

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