Bonding Method between Combined Heat Storage Plates
Briefly introduce the bonding method between the composite heat storage body plates.
Bonding Method between Combined Heat Storage Plates
The connection method between the composite thermal regenerator plates directly affects structural integrity, thermal shock resistance, and service life. Mechanical stacking is the most common method, but different bonding schemes are required for specific operating conditions.
Comparison of Main Bonding Methods
Method | Principle | Thermal stress | Sealing | Maintenance | Applicable |
Mechanical stacking | Direct stacking, no bonding | Minimum | Poor | Optimum | RTO heat storage element (most commonly used) |
Inorganic bonding | Ceramic cement solidified connection | Medium | Good | Poor | Medium and low temperature regenerator |
Sintered connection | Interface sintering at high temperature | Large | Optimal | Unavailable | One-piece structure |
Fiber pad | Sandwiched with ceramic fiber pad | Small | Medium | Better | Large size, large temperature difference |
Detailed Explanation of Each Method
Mechanical Stacking: Plates are directly stacked and secured by their own weight. This method minimizes thermal stress, allows for individual plate replacement, and has the lowest cost. However, it suffers from poor sealing and is the standard practice for RTO regenerators.
Inorganic Binders: Use silica sol or phosphates for bonding. This method offers good integrity and strong sealing, but carries the risk of thermal stress and cannot be disassembled.
Sintered Bonding: Green bodies are stacked and sintered together. This method offers the highest interfacial bonding strength, but it is maintenance-free and has a complex manufacturing process. It is mainly used for integrated honeycomb ceramics.
Fiber Liners: Ceramic fiber mats are sandwiched between plates. This method provides flexible thermal stress absorption and is easy to install and remove, but the fiber mats require periodic replacement after long-term use.
Selection Recommendations
Operating Condition | Recommended Method | Reason |
Frequent thermal shock to RTO | Mechanical stacking | No thermal stress, replaceable |
Low-temperature heat storage (<800℃) | Inorganic binder (aluminate cement) | Low cost |
High-temperature heat storage (>1200℃) | Inorganic binder (phosphate) | Sufficient temperature resistance |
Requires sealing to prevent short circuits | Inorganic binder or fiber gasket | Good sealing performance |
Requires frequent disassembly | Mechanical stacking | Single-piece replacement |
Summary
Plate bonding method: Mechanical stacking has no thermal stress and is easy to maintain, and is the first choice for RTO; inorganic bonding is good overall but has the risk of thermal stress; sintered connection has the highest strength but is not detachable; fiber liner is flexible and shock-absorbing. Selection is based on thermal shock frequency, temperature and maintenance requirements.